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BGM210PA32JIA2

Bluetooth Module, BLE 5.1, 2 Mbps, 1.71 V to 3.8 V, -94.1 dBm, -40 °C to 125 °C

SILICON LABS BGM210PA32JIA2
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Manufacturer Part No:
BGM210PA32JIA2
Order Code:
3605122
Product Range
BGM210P Series
Technical Datasheet:
BGM210PA32JIA2   Datasheet
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Product Range Selector (BGM210P Series)

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Product Overview

BGM210P wireless Gecko Bluetooth module based on the EFR32BG21 SoC, it enables Bluetooth® Low Energy and Bluetooth Mesh connectivity while delivering best-in-class RF range and performance, future-proof capability for feature and OTA firmware updates, enhanced security, low active current consumption, and a temperature rating suited for operating in demanding environmental conditions.
  • Bluetooth 5.1 and Bluetooth mesh connectivity
  • Built-in and RF pin
  • 20dBm TX power
  • Bluetooth RX sensitivity of -97.0dBm at 1Mbps
  • 32-bit ARM Cortex-M33 core at 38.4MHz
  • 1024/96KB of flash/RAM memory
  • Enhanced security features
  • Optimal set of MCU peripherals
  • 20 GPIO pins
  • Operating temperature range from -40⁰C to +125⁰C

Warnings

Market demand for this product has caused an extension in leadtimes. Delivery dates may fluctuate. Product exempt from discounts.

Product Information

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:
Bluetooth LE 5.1

:
1.71V

:
3.8V

:
-

:
2Mbps

:
Class 3

:
-94.1dBm

:
-40°C

:
125°C

:
BGM210P Series

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Technical Docs (2)

CAD Downloads

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CAD Models - Notice
CAD Models and drawings are provided to you on a revocable limited licence for your internal use only but remain the property of the manufacturer who retain all intellectual property rights and ownership. They are provided to assist you in decision making and as design guide but are not guaranteed to be error free, accurate or up to date and is not intended to be taken as advice.
Use of these CAD models and other options provided are downloaded and used entirely at your own risk and by continuing you confirm acceptance of the above.

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Packaging type Re-reel

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Deliveries start from 15/05/22

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