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113991115
SBC, XIAO ESP32S3 Sense, Xtensa LX7, 8MB RAM, 8MB Flash, Wifi, Bluetooth, USB 2.0, USB serial/JTAG
Image is for illustrative purposes only. Please refer to product description.

| Manufacturer | SEEED STUDIO |
|---|---|
| Manufacturer Part No | 113991115Copy |
| Manufacturer Standard Lead Time | 17 weeks |
| Order Code | 4200197 |
| Product Range | TUK SGACK902S Keystone Coupler |
| Your Part Number | |
| Technical Datasheet |
Available to Order
Manufacturer Standard Lead Time: 17 week(s)
Notify me when back in stock
| Quantity | Price (Incl GST) |
|---|---|
| 1+ | $20.040 ($22.044) |
Price for:Each
Minimum: 1
Multiple: 1
$20.04 ($22.04 inc GST)
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Added to your Order Confirmation, Invoice, and Dispatch note for this order only.
Product Information
| Manufacturer | SEEED STUDIO |
|---|---|
| Manufacturer Part No | 113991115Copy |
| Manufacturer Standard Lead Time | 17 weeks |
| Order Code | 4200197 |
| Product Range | TUK SGACK902S Keystone Coupler |
| Technical Datasheet | |
| Silicon Manufacturer | Espressif Systems |
| No. of Bits | 32bit |
| Silicon Family Name | XIAO |
| Core Architecture | Xtensa |
| Core Sub-Architecture | LX7 |
| Silicon Core Number | ESP32-S3R8 |
| Kit Contents | Dev Board ESP32-S3R8, Plug-in Camera Sensor Board, Antenna |
| Product Range | TUK SGACK902S Keystone Coupler |
Product Overview
Seeed Studio XIAO ESP32S3 leverages dual-core ESP32S3 chip, supporting both Wi-Fi and BLE wireless connectivity's, which allows battery charge. It integrates built-in camera sensor, digital microphone. It offers 8MB PSRAM, 8MB FLASH, and external SD card slot for supporting up to 32GB FAT memory. All of these make it suitable for embedded ML, like intelligent voice and vision AI.
- Incorporate the ESP32S3 32-bit, dual-core, Xtensa processor chip operating up to 240MHz
- Detachable OV2640 camera sensor for 1600X1200 resolution, compatible with OV5640, digital microphone
- Support 2.4GHz Wi-Fi and BLE dual wireless, support 100m+ remote communication with U.FL antenna
- 21 x 17.5mm, adopting the classic form factor of XIAO, suitable for projects like wearable devices
Contents
XIAO ESP32S3 x1, Plug-in camera sensor board x1, Antenna x1.
Technical Specifications
| Silicon Manufacturer | Espressif Systems |
|---|---|
| Silicon Family Name | XIAO |
| Core Sub-Architecture | LX7 |
| Kit Contents | Dev Board ESP32-S3R8, Plug-in Camera Sensor Board, Antenna |
| No. of Bits | 32bit |
|---|---|
| Core Architecture | Xtensa |
| Silicon Core Number | ESP32-S3R8 |
| Product Range | TUK SGACK902S Keystone Coupler |
Technical Docs (1)
Legislation and Environmental
| Country of Origin: Country in which last significant manufacturing process was carried outCountry of Origin: | China Country in which last significant manufacturing process was carried out |
|---|---|
| Tariff No: | 84733020 |
| US ECCN: | 5A992.c |
| EU ECCN: | NLR |
| RoHS Compliant: | To be advised |
| RoHS Phthalates Compliant: | To be advised |
| Download Product Compliance Certificate | Product Compliance Certificate |
| Weight (kg): | .005 |
