Print Page
Image is for illustrative purposes only. Please refer to product description.
ManufacturerMICRON
Manufacturer Part NoMT53E1G32D2FW-046 AIT:C
Order Code4723252
Your Part Number
Technical Datasheet
1,360 total stock globally
Need more?
1360 Delivery in 3-5 Business Days(UK stock)
| Quantity | Price (Incl GST) |
|---|---|
| 1+ | $583.680 ($642.048) |
Price for:Each
Minimum: 1
Multiple: 1
$583.68 ($642.05 inc GST)
Line Note
Added to your Order Confirmation, Invoice, and Dispatch note for this order only.
Product Information
ManufacturerMICRON
Manufacturer Part NoMT53E1G32D2FW-046 AIT:C
Order Code4723252
Technical Datasheet
DRAM TypeMobile LPDDR4
Memory Density32Gbit
Memory Configuration1G x 32bit
Clock Frequency Max2.133GHz
IC Case / PackageFBGA
No. of Pins-
Supply Voltage Nom1.1V
IC MountingSurface Mount
Operating Temperature Min-40°C
Operating Temperature Max95°C
Product Range-
SVHCNo SVHC (21-Jan-2025)
Product Overview
MT53E1G32D2FW-046 AIT:C is a mobile LPDDR4 SDRAM. The low-power DDR4 SDRAM (LPDDR4) is a high-speed, CMOS dynamic random-access memory device. This 8-bank device is internally configured with ×16 I/O. Each of the ×16 2,147,483,648-bit banks are organized as 131,072 rows by 1024 columns by 16 bits. LPDDR4 uses a double-data-rate (DDR) protocol on the DQ bus to achieve high-speed operation. The DDR interface transfers two data bits to each DQ lane in one clock cycle and is matched to a 16n-prefetch DRAM architecture.
- 16n prefetch DDR architecture, 8 internal banks per channel for concurrent operation
- Single-data-rate CMD/ADR entry, bidirectional/differential data strobe per byte lane
- Programmable READ and WRITE latencies (RL/WL), programmable and on-the-fly burst lengths (BL=16, 32)
- Directed per-bank refresh for concurrent bank operation and ease of command scheduling
- On-chip temperature sensor to control self refresh rate
- Partial-array self refresh (PASR), selectable output drive strength (DS), clock-stop capability
- 4GB (32Gb) total density, 4266Mb/s data rate per pin
- 1.10V VDD2/0.60V or 1.10V VDDQ operating voltage
- 200-ball TFBGA package, AEC-Q100 automotive qualified
- Operating temperature from -40°C to +95°C
Technical Specifications
DRAM Type
Mobile LPDDR4
Memory Configuration
1G x 32bit
IC Case / Package
FBGA
Supply Voltage Nom
1.1V
Operating Temperature Min
-40°C
Product Range
-
Memory Density
32Gbit
Clock Frequency Max
2.133GHz
No. of Pins
-
IC Mounting
Surface Mount
Operating Temperature Max
95°C
SVHC
No SVHC (21-Jan-2025)
Technical Docs (1)
Legislation and Environmental
Country of Origin:
Country in which last significant manufacturing process was carried outCountry of Origin:Taiwan
Country in which last significant manufacturing process was carried out
Country in which last significant manufacturing process was carried outCountry of Origin:Taiwan
Country in which last significant manufacturing process was carried out
Tariff No:85423239
US ECCN:EAR99
EU ECCN:NLR
RoHS Compliant:Yes
RoHS
RoHS Phthalates Compliant:Yes
RoHS
SVHC:No SVHC (21-Jan-2025)
Download Product Compliance Certificate
Product Compliance Certificate
Weight (kg):.000001