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| Manufacturer | FLEXXON |
|---|---|
| Manufacturer Part No | FEMC256GBE-E530Copy |
| Manufacturer Standard Lead Time | 27 weeks |
| Order Code | 4378881 |
| Product Range | 3.3V eMMC NAND Flash Memories |
| Your Part Number | |
| Technical Datasheet |
11 total stock globally
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11 Delivery in 3-5 Business Days(UK stock)
| Quantity | Price (Incl GST) |
|---|---|
| 1+ | $323.790 ($356.169) |
| 5+ | $291.410 ($320.551) |
| 10+ | $286.590 ($315.249) |
Price for:Each
Minimum: 1
Multiple: 1
$323.79 ($356.17 inc GST)
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Product Information
| Manufacturer | FLEXXON |
|---|---|
| Manufacturer Part No | FEMC256GBE-E530Copy |
| Manufacturer Standard Lead Time | 27 weeks |
| Order Code | 4378881 |
| Product Range | 3.3V eMMC NAND Flash Memories |
| Technical Datasheet | |
| Flash Memory Type | 3D TLC NAND |
| Memory Density | 256GB |
| Memory Configuration | 256G x 8bit |
| Interfaces | eMMC 5.1 |
| IC Case / Package | FBGA |
| No. of Pins | 100Pins |
| Clock Frequency Max | 200MHz |
| Access Time | - |
| Supply Voltage Min | 2.7V |
| Supply Voltage Max | 3.6V |
| Supply Voltage Nom | 3.3V |
| IC Mounting | Surface Mount |
| Operating Temperature Min | -40°C |
| Operating Temperature Max | 85°C |
| Product Range | 3.3V eMMC NAND Flash Memories |
| SVHC | To Be Advised |
Product Overview
FEMC256GBE-E530 is an AXO series industrial eMMC 5.1 flash memory. It is fully comply with JEDEC eMMC5.1 standard. It is combined of an embedded flash controller and standard 3D TLC NAND flash memory in one JEDEC standard package. It provides high performance, good reliability and advanced power management. It is suitable for small, low power electronic devices.
- 256GB capacity, VCCQ: 1.8V/3.3V, VCC: 3.3V power system
- Compliant with eMMC specification Ver. 5.1
- High-speed eMMC protocol, clock frequency range from 0 to 200MHz
- Supports three data bus widths: 1 bit (default), 4bits, 8bits
- Supports high speed mode HS400, supports production state awareness
- Supports field firmware update
- Supply voltage (NAND) range from 2.7 to 3.6V, 1.125V/ns min slew rate (with respect to VIH/VIL)
- Clock rise time is 3ns max (CL ≤30pF), clock fall time is 3ns max (CL ≤30pF)
- Output delay time during data transfer is 13.7ns max (CL ≤30 pF)
- 100-ball FBGA package, operation temperature range from -40°C to 85°C
Technical Specifications
| Flash Memory Type | 3D TLC NAND |
|---|---|
| Memory Configuration | 256G x 8bit |
| IC Case / Package | FBGA |
| Clock Frequency Max | 200MHz |
| Supply Voltage Min | 2.7V |
| Supply Voltage Nom | 3.3V |
| Operating Temperature Min | -40°C |
| Product Range | 3.3V eMMC NAND Flash Memories |
| Memory Density | 256GB |
|---|---|
| Interfaces | eMMC 5.1 |
| No. of Pins | 100Pins |
| Access Time | - |
| Supply Voltage Max | 3.6V |
| IC Mounting | Surface Mount |
| Operating Temperature Max | 85°C |
| SVHC | To Be Advised |
Technical Docs (1)
Legislation and Environmental
| Country of Origin: Country in which last significant manufacturing process was carried outCountry of Origin: | Taiwan Country in which last significant manufacturing process was carried out |
|---|---|
| Tariff No: | 85423990 |
| US ECCN: | 5A992.c |
| EU ECCN: | NLR |
| RoHS Compliant: | Yes RoHS |
| RoHS Phthalates Compliant: | Yes RoHS |
| SVHC: | To Be Advised |
| Download Product Compliance Certificate | Product Compliance Certificate |
| Weight (kg): | .013608 |
