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ICK BGA 23 X 23
Heat Sink, For Ball Grid Array, 23 °C/W, BGA, PLCC, 23 mm, 6 mm, 23 mm
Image is for illustrative purposes only. Please refer to product description.
ManufacturerFISCHER ELEKTRONIK
Manufacturer Part NoICK BGA 23 X 23Copy
Manufacturer Standard Lead Time13 weeks
Order Code121170202
Your Part Number
440 total stock globally
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440 Delivery in 3-5 Business Days(UK stock)
| Quantity | Price (Incl GST) |
|---|---|
| 1+ | $3.710 ($4.081) |
Price for:Each
Minimum: 1
Multiple: 1
$3.71 ($4.08 inc GST)
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Product Information
ManufacturerFISCHER ELEKTRONIK
Manufacturer Part NoICK BGA 23 X 23Copy
Manufacturer Standard Lead Time13 weeks
Order Code121170202
Technical Datasheet
Product Overview
The ICK BGA 23X23 is a 23 x 23 x 6mm Heat Sink made of aluminium with black anodized surface. This ICK series heat sink can be attached to recommended devices by thermal conductive adhesives and foils. This heat sink acts as a socket suitable for universal processors.
- 1.8mm Plate thickness
Applications
Industrial
Technical Docs (1)
Legislation and Environmental
Country of Origin:
Country in which last significant manufacturing process was carried outCountry of Origin:Germany
Country in which last significant manufacturing process was carried out
Country in which last significant manufacturing process was carried outCountry of Origin:Germany
Country in which last significant manufacturing process was carried out
Tariff No:76169990
RoHS Compliant:Yes
RoHS
RoHS Phthalates Compliant:Yes
RoHS
Download Product Compliance Certificate
Product Compliance Certificate
Weight (kg):.003175