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TS391SNL50
Solder Paste, Synthetic No Clean, 220 °C, 96.5, 3, 0.5 Sn, Ag, Cu, 50G
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ManufacturerCHIP QUIK
Manufacturer Part NoTS391SNL50
Order Code354932402
Your Part Number
Technical Datasheet
37 total stock globally
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37 Delivery in 3-5 Business Days(UK stock)
| Quantity | Price (Incl GST) |
|---|---|
| 1+ | $34.345 ($37.7795) |
Price for:Each
Minimum: 1
Multiple: 1
$34.34 ($37.78 inc GST)
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Added to your Order Confirmation, Invoice, and Dispatch note for this order only.
Product Information
Product Overview
No-clean, lead-free, thermally stable solder paste in 50g jar.
- Printing speeds up to 125mm/sec.
- Long stencil life
- Wide process window
- Clear residue
- Low voiding
- Excellent wetting compatibility on most board finishes
- Dispense grade
- Compatible with enclosed print heads
- T4 mesh
- No refrigeration required
- Alloy: Sn96/Ag3/Cu0.5
Technical Docs (2)
Legislation and Environmental
Country of Origin:
Country in which last significant manufacturing process was carried outCountry of Origin:United States
Country in which last significant manufacturing process was carried out
Country in which last significant manufacturing process was carried outCountry of Origin:United States
Country in which last significant manufacturing process was carried out
Tariff No:38101000
RoHS Compliant:Yes
RoHS
RoHS Phthalates Compliant:Yes
RoHS
Download Product Compliance Certificate
Product Compliance Certificate
Weight (kg):.072