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TS391LT50
Solder Paste, Synthetic No Clean, 138 °C, 42, 57.6, 0.4 Sn, Bi, Ag, 50G
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ManufacturerCHIP QUIK
Manufacturer Part NoTS391LT50
Order Code354932202
Your Part Number
Technical Datasheet
33 total stock globally
9 more incoming. You can reserve stock now
33 Delivery in 3-5 Business Days(UK stock)
| Quantity | Price (Incl GST) |
|---|---|
| 1+ | $41.040 ($45.144) |
Price for:Each
Minimum: 1
Multiple: 1
$41.04 ($45.14 inc GST)
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Added to your Order Confirmation, Invoice, and Dispatch note for this order only.
Product Information
Product Overview
No-clean, lead-free, low temperature thermally stable solder paste in 50g jar.
- Low melting point (138°) allows lower heat setting and reduces thermal damage to delicate components
- Printing speeds up to 125mm/sec
- Long stencil life
- Wide process window
- Clear residue
- Low voiding
- Excellent wetting compatibility on most board finishes
- Dispense grade
- Compatible with enclosed print heads
- No refrigeration required
- Alloy: Sn42/Bi57.6/Ag0.4
Technical Docs (1)
Legislation and Environmental
Country of Origin:
Country in which last significant manufacturing process was carried outCountry of Origin:United States
Country in which last significant manufacturing process was carried out
Country in which last significant manufacturing process was carried outCountry of Origin:United States
Country in which last significant manufacturing process was carried out
Tariff No:38101000
RoHS Compliant:Yes
RoHS
RoHS Phthalates Compliant:Yes
RoHS
Download Product Compliance Certificate
Product Compliance Certificate
Weight (kg):.072