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TS391LT50
Solder Paste, Synthetic No Clean, 138 °C, 42, 57.6, 0.4 Sn, Bi, Ag, 50G
Image is for illustrative purposes only. Please refer to product description.
ManufacturerCHIP QUIK
Manufacturer Part NoTS391LT50Copy
Manufacturer Standard Lead Time6 weeks
Order Code354932201
Your Part Number
69 total stock globally
7 more incoming. You can reserve stock now
69 Delivery in 3-5 Business Days(UK stock)
| Quantity | Price (Incl GST) |
|---|---|
| 1+ | $34.680 ($38.148) |
Price for:Each
Minimum: 1
Multiple: 1
$34.68 ($38.15 inc GST)
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Added to your Order Confirmation, Invoice, and Dispatch note for this order only.
Product Information
ManufacturerCHIP QUIK
Manufacturer Part NoTS391LT50Copy
Manufacturer Standard Lead Time6 weeks
Order Code354932201
Technical Datasheet
Product Overview
No-clean, lead-free, low temperature thermally stable solder paste in 50g jar.
- Low melting point (138°) allows lower heat setting and reduces thermal damage to delicate components
- Printing speeds up to 125mm/sec
- Long stencil life
- Wide process window
- Clear residue
- Low voiding
- Excellent wetting compatibility on most board finishes
- Dispense grade
- Compatible with enclosed print heads
- No refrigeration required
- Alloy: Sn42/Bi57.6/Ag0.4
Technical Docs (1)
Legislation and Environmental
Country of Origin:
Country in which last significant manufacturing process was carried outCountry of Origin:United States
Country in which last significant manufacturing process was carried out
Country in which last significant manufacturing process was carried outCountry of Origin:United States
Country in which last significant manufacturing process was carried out
Tariff No:38101000
RoHS Compliant:Yes
RoHS
RoHS Phthalates Compliant:Yes
RoHS
Download Product Compliance Certificate
Product Compliance Certificate
Weight (kg):.072