17430M-04A
Thermally Conductive Material, Silicone, Fibreglass, 5W/m.K
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| Quantity | Price (Incl GST) |
|---|---|
| 1+ | $2.560 ($2.816) |
| 10+ | $2.310 ($2.541) |
| 25+ | $2.170 ($2.387) |
| 50+ | $2.070 ($2.277) |
| 100+ | $2.010 ($2.211) |
Product Information
Product Overview
17430M-04A is a highly conformable, thermally conductive, low modulus material. It is a soft and compliant gap filling material with a thermal conductivity of 5.0 W/m-K. The material offers exceptional thermal performance at low pressures due to a unique filler package and low-modulus resin formulation. The enhanced material is ideal for applications requiring low stress on components and boards during assembly. It maintains a conformable nature that allows excellent interfacing and wet-out characteristics, even to surfaces with high roughness and/or topography. It is offered with natural inherent tack on both sides of the material, eliminating the need for thermally-impeding adhesive layers. The top side has minimal tack for ease of handling. It is supplied with protective liners on both sides.
- Thermal conductivity of 5.0W/m-K
- High-compliance, low compression stress
- Fiberglass reinforced for shear and tear resistance
Technical Specifications
5W/m.K
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No SVHC (04-Feb-2026)
Silicone, Fibreglass
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GAP PAD TGP HC5000 Series
Technical Docs (1)
Legislation and Environmental
Country in which last significant manufacturing process was carried outCountry of Origin:China
Country in which last significant manufacturing process was carried out
RoHS
Product Compliance Certificate