GPHC5.0-0.040-02-0816

GPHC5.0-0.040-02-0816 is a GAP PAD HC 5.0 soft and compliant gap filling material with a thermal conductivity of 5.0W/m-K. The material offers exceptional thermal performance at low pressures due to a unique filler package and low-modulus resin formulation. The enhanced material is ideal for applications requiring low stress on components and boards during assembly. GAP PAD HC 5.0 maintains a conformable nature that allows for excellent interfacing and wet-out characteristics, even to surfaces with high roughness and/or topography. GAP PAD HC 5.0 is offered with natural inherent tack on both sides of the material, eliminating the need for thermally-impeding adhesive layers. The top side has minimal tack for ease of handling. GAP PAD HC 5.0 is supplied with protective liners on both sides.

• High-compliance, low compression stress
• Fiberglass reinforced for shear and tear resistance
• Natural tack, both sides (with fiberglass)
• 0.040" (1.02mm) standard thickness
• 8" x 16" standard sheet size