
| Manufacturer | ANALOG DEVICES |
|---|---|
| Manufacturer Part No | ADSD3500BCBZRL7Copy |
| Manufacturer Standard Lead Time | 13 weeks |
| Order Code | Re-Reel4333506RL Cut Tape4333506 |
| Your Part Number | |
| Technical Datasheet |
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| Packaging Type | Quantity | Unit Price: | Total |
|---|---|---|---|
| Cut Tape | 1 | $30.640 | $30.64 |
| Quantity | Price (Incl GST) |
|---|---|
| 1+ | $30.640 ($33.704) |
| 10+ | $24.470 ($26.917) |
| 25+ | $22.930 ($25.223) |
| 100+ | $21.530 ($23.683) |
| 250+ | $21.100 ($23.210) |
| 1000+ | $20.670 ($22.737) |
Product Information
| Manufacturer | ANALOG DEVICES |
|---|---|
| Manufacturer Part No | ADSD3500BCBZRL7Copy |
| Manufacturer Standard Lead Time | 13 weeks |
| Order Code | Re-Reel4333506RL Cut Tape4333506 |
| Technical Datasheet | |
| IC Function | Time-of-Flight Depth Image Signal Processor |
| Supply Voltage Min | - |
| Supply Voltage Max | - |
| IC Package Type | WLCSP |
| No. of Pins | 81Pins |
| Operating Temperature Min | -25°C |
| Operating Temperature Max | 85°C |
| Product Range | - |
| Automotive Qualification Standard | - |
| SVHC | No SVHC (04-Feb-2026) |
Product Overview
ADSD3500BCBZRL7 is a time-of-flight depth image signal processor for Analog Device's ToF products such as the ADTF3175 and ADSD3030. The depth ISP processes the raw phase frames from the ToF imager, generating the final radial depth, active brightness (AB), and confidence frames. It supports full computation of depth, active brightness and confidence data for 640 x 512 resolution and partial depth computation (pre-phase unwrap) for 1024 x 1024 resolution. Data and processing flow is controlled using the integrated ARM® Cortex®-M33. Computation is performed using dedicated hardware and memory, enabling a low-power ToF depth ISP solution. It also controls the boot-up of the image sensor module, loading of calibration data, and triggering of frames. It is used in applications such as augmented reality (AR) systems, robotics, building automation, machine vision systems.
- On-chip static random access memory (SRAM) for frame buffering and manipulation
- Arm cortex-M33 processor for data flow control, 1.8V I/O supply, 0.8V core supply
- QSPI controller (50MHz) and target (30MHz)
- 22 GPIO for external connectivity
- Crystal oscillator (24MHz) or external clock (24MHz, 19.2MHz)
- 4-lane MIPI CSI-2 receiver interface, 2.5Gbps per lane
- 2-lane MIPI CSI-2 transmitter interface, 2.5Gbps per lane
- Operating temperature range from -25°C to +85°C
- WLCSP with 9 x 9 ball array package
Notes
ADI products are only authorized (and sold) for use by the customer and are not to be resold or otherwise passed on to any third party
Technical Specifications
| IC Function | Time-of-Flight Depth Image Signal Processor |
|---|---|
| Supply Voltage Max | - |
| No. of Pins | 81Pins |
| Operating Temperature Max | 85°C |
| Automotive Qualification Standard | - |
| Supply Voltage Min | - |
|---|---|
| IC Package Type | WLCSP |
| Operating Temperature Min | -25°C |
| Product Range | - |
| SVHC | No SVHC (04-Feb-2026) |
Technical Docs (1)
Legislation and Environmental
| Country of Origin: Country in which last significant manufacturing process was carried outCountry of Origin: | Taiwan Country in which last significant manufacturing process was carried out |
|---|---|
| Tariff No: | 85423990 |
| US ECCN: | EAR99 |
| EU ECCN: | NLR |
| RoHS Compliant: | Yes RoHS |
| RoHS Phthalates Compliant: | Yes RoHS |
| SVHC: | No SVHC (04-Feb-2026) |
| Download Product Compliance Certificate | Product Compliance Certificate |
| Weight (kg): | .00001 |
