Next-Generation PCB Connectors
For High Speed Connectivity, High Power Circuitry and Space Saving Designs. View All
element14’s broad range of Low Profile Connectors feature both polarisation and secure friction-locking devices that offer high performance and reliability. These connectors have mated heights that can go as low as 1.55mm. Especially suited for PCB designs where space is a constraint and small form-factor is a requirement. View All
Applications:
- Consumer electronics: mobile phones, portable devices, digital camera, MP3 player, smartphone, tablet PC
- Wearables devices
- Data communications
ZPD Series
Offers wire-to-board, double row, crimp-style connectors have a 1.5mm (.059”) pitch and are molded in a RoHS compliant 94V0 polyamide material. The polarised ZPD series housings incorporate secure locking devices to prevent accidental disconnection due to routing of wires or vibration.

Low Profile Micro MATE-N-LOK
Offers Low Profile Micro MATE-N-LOK connector system features an ultra-slim design of less than 4.7mm in Vertical Height with the reliability and performance of the Micro MATE-N-LOK line of connectors. Less than 4.7mm in Vertical Height Required.
Pico-EZmate™ Wire-to-Board Connector System
Offers a mated height of 1.55mm (.061") for 2- to 5-circuit and 1.65mm (.065") for 6-circuit versions for miniature wire-to-board applications.
G125 Series Gecko 1.25mm Pitch Connectors
Offers a low profile, dual row cable-to-board and board-to-board interconnect solution.
TMM Series 2.00mm Pitch Header
Offers Ultra Low Profile (1.50mm) wire-to-board, double row, crimp-style connectors.element14 features an extensive range of Fine Pitch Connectors with pitches as low as 0.3mm. This helps to achieve a smaller form factor in both size and volume in the PCB design. View All
Applications:
- Consumer electronics: notebook, televisions, smartphones, digital camera
- Wireless networks
- Lighting
FH26 Series
The FH26 series from Hirose is a 0.3 mm pitch, 1.0 mm height, space-saving FPC connector. The series features a short mounting depth of only 3.2 mm. The actuator opening is a full 135º and there is a clear tactile audible click when rotation is complete.

M.2 (Next Generation Form Factor) Connectors
Helps to achieve a smaller form factor in both size and volume. With a 0.5mm pitch and 67 positions, the M.2 NGFF Connectors reduce connector height by 15%.
Pico-Clasp™ Single and Dual Row Wire-to-Board Connectors
Smallest pitch 1mm wire-to-board connector with positive lock.element14 High Power offering comprises wire-to-board, board-to-board, wire-to-panel and wire-to-wire connectors with cutting-edge current density at 10A to 65A per circuit. Our connectors offer premium housing features such as positive housing locks and polarised housing. View All
Applications:
- Industrial control automation, robotics and inverters
- Factory automation, washing machines, air conditioners, heaters and dryers
Dynamic Series
Dynamic Series consists of wire-to-board, wire-to-panel and wire-to-wire connectors with diverse housings available to meet most applications and offers up to 65A current capacity.

MegaFit
Offering cutting-edge current density at 23.0A per circuit; terminals provide six independent contact points for long-term reliability in virtually every industry and application.
PES Series: 6.35mm PowerStrip™/30 A High Power Socket Strip
High Power Header and Socket of up to 40A.
PLH Series
Offers Narrow design width that creates more space on the PCB with High Current Capacity of up to 66A and Spring-cage connection.element14 offers High Speed connectors with speeds from 10Gbps to over 25Gbps from leading brands to fulfill the rapid demand of High Speed Connectivity. These include pluggable I/O, Backplane and Edge Card Connectors. View All
Applications:
- Storage system
- Telecommunications, networking, servers, routers
- Medical diagnostics equipment
- Lighting
- Automation
zSFP+ High Speed Pluggable IO Connectors
zSFP+ is TE Connectivity’s next generation small form pluggable I/O connector with SFP/SFP+ backward-compatibility for hot-swap changes and fast data handling of up to 28 Gbps (with possible expansion to 40 Gbps.

STRADA Whisper
First of the next generation of high speed backplane interconnects with an industry leading data rate of up to 40 Gb/s.
EdgeLine High Speed Edge Card Connectors
Support up to 25 Gbps data rates and are available in multiple orientations and PCB thicknesses from 1.57mm to 3.18mm for use in high-speed transmissions.
Mini-SAS HD
Offering Next generation SAS storage interface addressing channel bandwidth requirements of 6 Gb/s to 12 Gb/s, meeting or exceeding the respective SAS 2.1 and proposed SAS 3.0 specifications.






















