Power density, RDS(on) and miniaturization

In virtually every application, getting the right balance of power density and RDS(on) in the right footprint is becoming increasingly critical. Nexperia offers a broad portfolio of N- and P-channel power MOSFETs, ranging from 12 V to 100 V, in space-saving and efficient package options including our proven copper-clip LFPAK technology. And as a long-term supplier to the automotive industry, you can be assured we maintain the highest quality and reliability standards.

NextPowerS3 MOSFETs

Safe, Reliable and Efficient

A high-performance 25 V, 30 V and 40 V MOSFET platform incorporating Nexperia’s unique superjunction technology, with the copper-clip LFPAK package to deliver low RDS(on) , as well as demonstrating a continuous current capability up to 380 A. These parameters working synchronously, i.e. strong/realistic ID max rating, very strong SOA and low RDS(on) making for uniquely positioned high performance and highly reliable MOSFETs without compromise.

Features and benefits

  • Balanced RDS(on) and Qg for class leading efficiency
  • Unique Schottky-Plus technology delivers low spiking without compromising efficiency or IDSS leakage
  • High reliability LFPAK packages. copper-clip, solder die attach and qualified to 175°C
  • 425 A continuous current demonstrated
  • 4x SOA capability compared to leading competitors

Applications

  • Low RDS(on) types for power ORing, hotswap and soft start
  • DC to DC solutions for server and telecoms
  • Voltage Regulator Modules (VRM)
  • Point of Load (PoL) modules
  • Secondary side synchronous rectification
  • Brushed and brushless DC motor control

Automotive MOSFETs

A comprehensive portfolio of automotive small signal MOSFETs

Providing the broadest portfolio of small signal MOSFETs (<1 Ohm) automotive qualified (AEC-Q101) and PPAP capable. Wide range of package options from proven SMD to latest DFN technology with side wettable flanks (SWF). Majority of portfolio with high ESD robustness (>2 kV) for a vast choice of applications in the automotive domain.

Features and benefits

  • Broad range of packages from optimum choice side-wettable flanks for optical solder inspection
  • Leadless packages contain tin plated side contacts for automatic optical inspection (AOI) and improved solder joint quality
  • Replacement of larger packages
  • Performance improvements in wafer technology and in package technology, especially leadless (DFN) packages enable higher electrical and thermal performance on a smaller footprint
  • Automotive compliant (AEC-Q101)

Applications

  • Body control units
    • Doors
    • Window lift
    • Seat control
  • Entertainment systems
    • Car radio
    • Navigation
  • Safety and control systems
    • Air bag
    • LED lighting

Power MOSFETs

Optimized to your needs

As designers push the boundaries of application performance, it is increasingly crucial to understand how the MOSFET will be used in the application. In the past a standard power switch with a given figure of merit (FOM) would essentially work in any application. However, to address specific application requirements or functionality, it is increasingly necessary to optimize a set of MOSFET parameters to best match those requirements. For example, applications may require enhanced linear mode performance, or repetitive avalanche functionality . Nexperia combine the proven MOSFET expertise with broad application understanding to create an expanding range of application specific MOSFETs.

Application specific power MOSFETs - incl. ASFETs for Power over Ethernet (PoE), ASFETs for Battery Isolation, ASFETs for DC Motor Control, AFETs for Hotswap and Soft Start

ASFETs for Power over Ethernet

  • MOSFET’s primary role is to safely manage inrush current when capacitive loads are added to the network
  • Extended enhanced Safe Operating Area (SOA) to withstand power dissipation due to short-circuit fault conditions until the PSE controller detects the fault and switches off
  • Enhanced protection – our MOSFETs offer more than 2x the protection of competitive devices. During a cable short fault, our ASFETs for PoE can safely dissipate up to 30 W under +60 °C ambient for up to 20 ms
  • To squeeze more high-power PoE ports into a compact router / switch requires superior power density offered by the thermal efficiency and compact footprint of the LFPAK33 package

ASFETs for Battery Isolation

  • Under a fault situation, the Battery Isolation MOSFET normally goes into linear mode due to voltages being developed across circuit inductance at high current when the fault causes a deep discharge
  • Strong SOA MOSFETs continue to operate safely and controllably until switch off and the battery is fully isolated from the load circuit
  • A low RDS(on) is required for low conduction losses in normal operation, but parameters need to be optimized for safe Battery Isolation
  • Robust Battery Isolation MOSFETs can be used as the primary protection for equipment approval
  • A low Vt may be required as battery protection IC may only have 2–3 V gate drive

ASFET for Hotswap and Soft Start

  • MOSFETs with a strong linear mode performance and enhanced Safe Operating Area (SOA) are required to manage in-rush current effectively and reliably when capacitive loads are introduced to the backplane
  • Once a replacement board is safely powered up, the MOSFET is turned fully ON. In this mode of operation, a low RDS(on) value is of primary importance, helping to keep temperatures down and system efficiency at a maximum

ASFETs for DC Motor Control

  • 50/55 V for 36 V DC motors - Optimised SOA, high ID rating and excellent avalanche capability​
  • High ID for motor overload conditions - Highest current capability up to 500A
  • Half-bridge for space constrained motor applications​ - 60% lower parasitic inductance and improved thermal performance
  • Repetitive avalanche for space constrained DC motors - Guaranteed repetitive avalanche performance

Resources

Consumer Device MOSFETs

High volume small-signal MOSFETs

Small signal MOSFETs for mobile, for applications such as relay drivers, switching circuits, DC/DC converters and more. Offering a wide range of package options from the smallest packages like DFN0606 and leadless ultra-thin DFN2020M-6. Optimum choice between N-Channel and P-Channel with a variety of RDS(on) ranges.

Features and benefits

  • Low threshold voltage
  • Very fast switching
  • Featuring smallest DFN MOSFET in 0.63x0.33x0.25mm, and the leadless ultra thin SMD DFN2020M-6 package
  • Best in class low RDS(on)

Applications

  • Relay driver
  • High-speed line driver
  • High-side load switch
  • Switching circuits
  • Battery switch
  • Charging switch for portable devices
  • DC-to-DC converters
  • Power management in battery-driven portable devices
  • Computing power management

Schottky Diodes

Schottky rectifiers with low Qrr and well-balanced VF/IR tradeoff for high-speed switching applications

Nexperia Trench Schottky rectifiers in Clip-bonded FlatPower (CFP) packages meet the challenging demands of efficient and space-saving designs. They combine low reverse current, low forward voltage and lowest Qrr to enable best efficiency at high ambient temperatures. Available in four CFP package options with high power capabilities they offer a true alternative to SMA, with better thermal performance, on smaller footprint. For a range of automotive, industrial, consumer and computing applications – ideal in LED lighting, powertrain systems in hybrid vehicles and high-temperature applications.

Features and benefits

  • VR max (V): 40-100
  • IF max (A): 1-20
  • AEC-Q101 qualified
  • Junction temperature up to 175 °C
  • Low forward voltage
  • Low Qrr and low IRM
  • Low leakage current
  • High power capability due to clip-bonding technology
  • Small and flat lead SMD power plastic package

Applications

  • High efficiency DC-to-DC conversion
  • Automotive LED lighting
  • Switch mode power supply
  • Freewheeling application
  • Reverse polarity protection
  • OR-ing