Heat Sinks

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M414/TO3
M414/TO3 - Transistor Pad, Transistors Case Style TO-3, 40.26 mm x 26.54 mm

170031

Transistor Pad, Transistors Case Style TO-3, 40.26 mm x 26.54 mm

MULTICOMP PRO

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5+ $1.20 ($1.32) 75+ $0.93 ($1.02) 150+ $0.767 ($0.84) 250+ $0.698 ($0.77) 500+ $0.63 ($0.69) 1500+ $0.557 ($0.61) More Pricing...

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ICK SMD A 10 SA
ICK SMD A 10  SA - Heat Sink, Square, PCB, For SMD Packages, 75 °C/W, SOIC-16, SOIC-18, 6.3 mm, 4.8 mm, 10 mm

4302187

Heat Sink, Square, PCB, For SMD Packages, 75 °C/W, SOIC-16, SOIC-18, 6.3 mm, 4.8 mm, 10 mm

FISCHER ELEKTRONIK

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ICK 24 B
ICK 24 B - Heat Sink, DIP, Glue-On, 13 °C/W, DIP, 19 mm, 4.8 mm, 33 mm

4620914

Heat Sink, DIP, Glue-On, 13 °C/W, DIP, 19 mm, 4.8 mm, 33 mm

FISCHER ELEKTRONIK

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SK 145/37,5 STS-220
SK 145/37,5 STS-220 - Heat Sink, TO-220, 12 °C/W, TO-218, TO-220, TO-247, TO-248, 29 mm, 37.5 mm, 12 mm

4621414

Heat Sink, TO-220, 12 °C/W, TO-218, TO-220, TO-247, TO-248, 29 mm, 37.5 mm, 12 mm

FISCHER ELEKTRONIK

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ICK SMD A 8 SA
ICK SMD A  8  SA - Heat Sink, Black Anodised, 87 °C/W,  For DIP, PLCC, SMD, 4.8mm/6.3mm/8mm

4302175

Heat Sink, Black Anodised, 87 °C/W, For DIP, PLCC, SMD, 4.8mm/6.3mm/8mm

FISCHER ELEKTRONIK

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SK 81/ 100 SA
SK 81/ 100 SA - Heat Sink, Extruded, 3.4 °C/W, 100 mm, 15 mm, 100 mm

1211719

Heat Sink, Extruded, 3.4 °C/W, 100 mm, 15 mm, 100 mm

FISCHER ELEKTRONIK

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3.4°C/W - 100mm 15mm
577202B00000G
577202B00000G - Heat Sink, Square, PCB, 24.4 °C/W, TO-220, 13.21 mm, 12.7 mm, 19.05 mm

1611441

Heat Sink, Square, PCB, 24.4 °C/W, TO-220, 13.21 mm, 12.7 mm, 19.05 mm

BOYD

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24.4°C/W TO-220 13.21mm 12.7mm
241204B91200G.
241204B91200G. - HEAT SINK

1433989

HEAT SINK

BOYD

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2.2°C/W Half Brick 57.9mm 11.43mm
ICK BGA 40 X 40 X 10
ICK BGA 40 X 40 X 10 - Heat Sink, Square, PCB, For Ball Grid Arrays, 13.8 °C/W, BGA, 40 mm, 10 mm, 40 mm

1850047

Heat Sink, Square, PCB, For Ball Grid Arrays, 13.8 °C/W, BGA, 40 mm, 10 mm, 40 mm

FISCHER ELEKTRONIK

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13.8°C/W BGA 40mm 10mm
MPX05GFNB
MPX05GFNB - Transistor Pad, TO-92 Packages

519972

Transistor Pad, TO-92 Packages

MULTICOMP PRO

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890SP-02000-A-100
890SP-02000-A-100 - Heat Sink, Ultra-Fin™, 0.07 °C/W, 101.6 mm, 32 mm, 200 mm

4105990

Heat Sink, Ultra-Fin™, 0.07 °C/W, 101.6 mm, 32 mm, 200 mm

H S MARSTON

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ICK SMD A 5 SA
ICK SMD A  5  SA - Heat Sink, For SMD, 123 °C/W, SOIC-8, SOIC-14, SSOP-16, TSSOP-14, TSSOP-16, 6.3 mm, 4.8 mm, 5 mm

4302163

Heat Sink, For SMD, 123 °C/W, SOIC-8, SOIC-14, SSOP-16, TSSOP-14, TSSOP-16, 6.3 mm, 4.8 mm, 5 mm

FISCHER ELEKTRONIK

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FK 244 13 D2 PAK
FK 244 13 D2 PAK - Heat Sink, Square, PCB, For D Pak, 22.8 °C/W, SO-8, SO-10, SO-14, SO-16, SOT-223, TO-263, 13 mm

4302436

Heat Sink, Square, PCB, For D Pak, 22.8 °C/W, SO-8, SO-10, SO-14, SO-16, SOT-223, TO-263, 13 mm

FISCHER ELEKTRONIK

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SK 81/ 50 SA
SK 81/ 50 SA - Heat Sink, Extruded, 3.4 K/W, 100 mm, 15 mm, 50 mm

1211718

Heat Sink, Extruded, 3.4 K/W, 100 mm, 15 mm, 50 mm

FISCHER ELEKTRONIK

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3.4K/W - 100mm 15mm
SW25-4
SW25-4 - Heat Sink, TO-220/218, 13 °C/W, TO-218, TO-220, TO-247, 34.5 mm, 25 mm, 12.5 mm

1213436

Heat Sink, TO-220/218, 13 °C/W, TO-218, TO-220, TO-247, 34.5 mm, 25 mm, 12.5 mm

BOYD

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13°C/W TO-218, TO-220, TO-247 34.5mm 25mm
SK 481 100
SK 481 100 - Heat Sink, Extruded, For Lock-In Retaining Spring, 2.8 °C/W, TO-3P, TO-218, TO-220, TO-247, TO-248

1892334

Heat Sink, Extruded, For Lock-In Retaining Spring, 2.8 °C/W, TO-3P, TO-218, TO-220, TO-247, TO-248

FISCHER ELEKTRONIK

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2.8°C/W TO-3P, TO-218, TO-220, TO-247, TO-248 30mm 45mm
TV5G
TV5G - Heat Sink, PCB, Board Level, 21.6 °C/W, TO-126, 22 mm, 19 mm, 19 mm

170072

Heat Sink, PCB, Board Level, 21.6 °C/W, TO-126, 22 mm, 19 mm, 19 mm

BOYD

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890SP-01000-A-100
890SP-01000-A-100 - Heat Sink, Ultra-Fin™, 0.12 °C/W, 101.6 mm, 32 mm, 100 mm

4105977

Heat Sink, Ultra-Fin™, 0.12 °C/W, 101.6 mm, 32 mm, 100 mm

H S MARSTON

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577102B00000G
577102B00000G - Heat Sink, Square, PCB, 25.9 °C/W, TO-220, 13.21 mm, 9.52 mm, 19.05 mm

1703172

Heat Sink, Square, PCB, 25.9 °C/W, TO-220, 13.21 mm, 9.52 mm, 19.05 mm

BOYD

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25.9°C/W TO-220 13.21mm 9.52mm
1.25GY-50
1.25GY-50 - Heat Sink, TO-220, 6.8 °C/W, TO-220, 32 mm, 16 mm, 60 mm

175009

Heat Sink, TO-220, 6.8 °C/W, TO-220, 32 mm, 16 mm, 60 mm

BOYD

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507302B00000G
507302B00000G - Heat Sink, Square, PCB, 24 °C/W, TO-220, 19.05 mm, 9.67 mm, 19.05 mm

1611415

Heat Sink, Square, PCB, 24 °C/W, TO-220, 19.05 mm, 9.67 mm, 19.05 mm

BOYD

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24°C/W TO-220 19.05mm 9.67mm
ICK 40 B
ICK 40 B - Heat Sink, DIP, Glue-On, 8.5 °C/W, DIP, 19 mm, 4.8 mm, 51 mm

4620926

Heat Sink, DIP, Glue-On, 8.5 °C/W, DIP, 19 mm, 4.8 mm, 51 mm

FISCHER ELEKTRONIK

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205AB0500B
205AB0500B - Heat Sink, TO-220, TO-218, 4.9 °C/W, TO-218, TO-220, 46 mm, 33 mm, 50 mm

177011

Heat Sink, TO-220, TO-218, 4.9 °C/W, TO-218, TO-220, 46 mm, 33 mm, 50 mm

ABL HEATSINKS

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4.9°C/W TO-218, TO-220 46mm 33mm
647-10-ABEP
647-10-ABEP - Heat Sink, For Board Level Power Semiconductor, 3.8 °C/W, TO-220, 41.9 mm, 25.4 mm, 25.4 mm

1219494

Heat Sink, For Board Level Power Semiconductor, 3.8 °C/W, TO-220, 41.9 mm, 25.4 mm, 25.4 mm

WAKEFIELD THERMAL

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3.8°C/W TO-220 41.9mm 25.4mm
274-1AB
274-1AB - Heat Sink, Square, PCB, 56 °C/W, TO-220, 13.2 mm, 9.5 mm, 19.1 mm

1611445

Heat Sink, Square, PCB, 56 °C/W, TO-220, 13.2 mm, 9.5 mm, 19.1 mm

WAKEFIELD THERMAL

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