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MULTICOMP  509-0726  SOLDER WIRE, LEAD FREE, 0.7MM, 500G

MULTICOMP 509-0726
Technical Data Sheet (137.03KB) EN See all Technical Docs

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Product Overview

  • Mildly activated no-clean flux formulation
  • Increased flux content (3% by weight) - low fuming and low spitting
  • Minimal clear residues do not require cleaning
  • Complies with all lead-free legislative requirements
  • Suitable for general lead-free, no-clean assembly, or rework of PCBs assembled in a lead-free no-clean process

 

Product Information

External Diameter - Metric:
0.7mm
External Diameter - Imperial:
0.028"
Solder Alloy:
99, 1 Sn, Cu
Melting Temperature:
227°C
Weight - Metric:
500g
Weight - Imperial:
1.102lb
Product Range:
-
SVHC:
To Be Advised

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Legislation and Environmental

Country of Origin:
Malaysia

Country in which last significant manufacturing process was carried out

RoHS Compliant:
Yes
Tariff No:
83113000
Weight (kg):
.5

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