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MULTICOMP  509-0684  SOLDER WIRE, LEAD FREE, 0.7MM, 250G

MULTICOMP 509-0684
Technical Data Sheet (538.40KB) EN See all Technical Docs

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Product Overview

  • Mildly activated no-clean flux formulation
  • Increased flux content (3% by weight) - low fuming and low spitting
  • Minimal clear residues do not require cleaning
  • Complies with all lead-free legislative requirements
  • Suitable for general lead-free, no-clean assembly, or rework of PCBs assembled in a lead-free no-clean process

 

Product Information

External Diameter - Imperial:
0.028 "
External Diameter - Metric:
0.7 mm
Melting Temperature:
227 °C
Product Range:
-
SVHC:
To Be Advised
Solder Alloy:
99.3, 0.7 Sn, Cu
Weight - Imperial:
8.818 oz
Weight - Metric:
250 g

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Legislation and Environmental

Country of Origin:
Malaysia

Country in which last significant manufacturing process was carried out

RoHS Compliant:
Yes
Tariff No:
83113000
Weight (kg):
.26

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  • Weight - Metric: 250g
  • Weight - Imperial: 8.818oz
  • Product Range: -
  • Melting Temperature: 227°C
  • Solder Alloy: 99.3, 0.7 Sn, Cu
  • External Diameter - Imperial: 0.028"
  • External Diameter - Metric: 0.7mm